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Home > O-ring, Seal Design > Semiconductor Plasma Semiconductor Plasma Environments and Elastomer SealsSemiconductor plasma environments offer significant challenges for elastomer seals. Specific chemistries for metal, oxide, poly etch and photoresist stripping equipment include the use of fluorine-, oxygen-, and chlorine-partially-ionized plasmas. The plasmas typically used are called "glow-discharge," and they operate in the range of 10-4 to 10 Torr, with electron densities of 109 to 1012 cm-3, and ion temperatures of 0.03 to 0.04eV (100-200°C). The function of a plasma is determined by: 1) the ability to deliver a uniform flux of energetic (+) ions to a surface with controllable energy and flux, and 2) the ability to deliver spatially uniform, relatively large fluxes of atoms and/or molecular radicals to surfaces. Three plasma properties that affect performance are:
Traditional measures of elastomer compatibility cover volume swell and physical property degradation as a result of exposure to the gas. Plasma environments offer many additional challenges for compatibility and contamination performance of the elastomer. Measures of elastomer compatibility in plasma environments should include weight loss (including elastomer physical properties), and surface structural and chemical changes as measured by SEM/EDS and ESCA. With all the variables involved, testing of the elastomer in the actual application is recommended. CF4 O2 1.00E+0 9. Next Topic Sealing in a Vacuum
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